Micron Technology will officially begin work on its megafab in Onondaga County, New York, on January 16, 2026. Having passed environmental review and necessary permit approvals, the project is set to be the largest semiconductor facility in the United States with up to four fabs.
Marking the largest private investment in New York state history, the project will be home to the most advanced memory manufacturing in the world and will help meet the growing demands of AI systems central to the modern economy.
As AI workloads scale across cloud and enterprise environments, memory availability has emerged as a critical limiting factor alongside compute. High-performance DRAM and high-bandwidth memory play a central role in determining model throughput, energy efficiency, and total cost of ownership for large-scale training and inference systems. Expanding advanced memory manufacturing capacity at this scale directly addresses a foundational constraint in AI infrastructure, with implications for data center planning, procurement timelines, and long-term platform reliability.
The location and scale of the New York megafab also carry strategic significance for enterprise AI adoption. By increasing domestic memory production, the project reduces exposure to concentrated global supply chains at a time when demand for AI-optimized hardware is accelerating and geopolitical risk remains elevated. While the investment does not introduce new AI products, it strengthens the underlying hardware supply that supports hyperscalers, cloud service providers, and enterprises planning multi-year AI deployments.
Sanjay Mehrotra, Chairman, President and CEO of Micron Technology, said: “Breaking ground at Micron’s New York megafab is a pivotal moment for Micron and the United States.
“As the global economy enters the AI era, leadership in advanced semiconductors will be the cornerstone of innovation and economic prosperity. Our investments and progress solidify our position as the only United States manufacturer of memory.”